Microscale Metallography Using Focused Ion Beam

Microstructural examination can provide a rich tapestry of information about the processing and application history of a metal component. For this reason, microstructural characterization is a fundamental tool for failure analysis of these components. To reduce costs and accommodate demands for smaller packaging, many applications currently use metallic components where the critical dimensions are only a few micrometers. In these instances, traditional metallographic techniques, including polishing and etching, are ineffective for microstructural characterization because small grain sizes make etching impossible or damage induced by mechanical grinding masks features of interest. An alternative technique is therefore needed to perform microscale metallography.